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      Vismid® LDS——High Performance Laser Direct Structuring Material
      Laser Direct Structuring, or LDS for short, is a method of processing ultra-fine circuits on a resin substrate by using laser.

      Injection molding

      The LDS material is used to inject the parts that will be directly structured by laser.


      Laser activation

      A special additive is added to the resin to have a laser-activating function. When laser engraving, a physicochemical reaction forms a metal core, which acts as a catalyst in copper plating.


      The process of metallization is to clean the part first, followed by electroless copper plating, forming the copper layer with thickness of about 5-8 μm, and finally nickel and gold are plated.


      Assembly


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      Antennas, sensors, other electrical and electronic components

      Series

      Grades

      Description

      PC/ABS

      Vismid® 3200LDS

      Very good  toughness and dimensional stability

      Vismid® 3201LDS

      UL 94 V-1; very   good toughness and dimensional stability

      PC

      Vismid® 2100LDS

      Excellent  toughness and dimensional stability

      Vismid® 2102LDS

      UL 94 V-0; excellent toughness and dimensional   stability

      Vismid® SOL 2100LDS

      Colorable, excellent toughness & dimensional stability

      Vismid® SOL   2102LDS

      Colorable, UL 94   V-0; excellent toughness and dimensional stability

      Vismid® SOL   2360LDS

      30% GF reinforced, colorable, high strength and stiffness,   excellent dimensional stability

      PA10T

      Vismid® SOL 6360LDS

      30% GF reinforced, high strength, superbly   low water absorption, high temperature resistance, suitable for SMT   lead-free soldering

      Vismid® SOL 65250LDS

      35% GF/Mineral  co-reinforced, superbly low water absorption, low warpage, high dimensional   stability, high  temperature resistance, suitable for SMT lead-free   soldering

      Vismid® SOL   6954LDS

      Thermally conductive; superbly low water absorption,   low warpage, excellent dimensional stability, high heat resistance

      LCP

      Vismid® SOL 8365LDS

      30% GF   reinforced, high temperature resistance, high flow, high dimensional   stability, suitable for thin-wall and fast-cycle molding and SMT lead-free   soldering process

      Vismid® SOL 8485LDS

      40% Mineral reinforced, high temperature resistance,   high flow, low warpage, high dimensional stability, suitable for thin-wall   and fast-cycle molding and SMT lead-free soldering process

       


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