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    Vismid® LDS——High Performance Laser Direct Structuring Material
    Laser Direct Structuring, or LDS for short, is a method of processing ultra-fine circuits on a resin substrate by using laser.

    Injection molding

    The LDS material is used to inject the parts that will be directly structured by laser.


    Laser activation

    A special additive is added to the resin to have a laser-activating function. When laser engraving, a physicochemical reaction forms a metal core, which acts as a catalyst in copper plating.


    The process of metallization is to clean the part first, followed by electroless copper plating, forming the copper layer with thickness of about 5-8 μm, and finally nickel and gold are plated.


    Assembly


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    Antennas, sensors, other electrical and electronic components

    Series

    Grades

    Description

    PC/ABS

    Vismid® 3200LDS

    Very good  toughness and dimensional stability

    Vismid® 3201LDS

    UL 94 V-1; very   good toughness and dimensional stability

    PC

    Vismid® 2100LDS

    Excellent  toughness and dimensional stability

    Vismid® 2102LDS

    UL 94 V-0; excellent toughness and dimensional   stability

    Vismid® SOL 2100LDS

    Colorable, excellent toughness & dimensional stability

    Vismid® SOL   2102LDS

    Colorable, UL 94   V-0; excellent toughness and dimensional stability

    Vismid® SOL   2360LDS

    30% GF reinforced, colorable, high strength and stiffness,   excellent dimensional stability

    PA10T

    Vismid® SOL 6360LDS

    30% GF reinforced, high strength, superbly   low water absorption, high temperature resistance, suitable for SMT   lead-free soldering

    Vismid® SOL 65250LDS

    35% GF/Mineral  co-reinforced, superbly low water absorption, low warpage, high dimensional   stability, high  temperature resistance, suitable for SMT lead-free   soldering

    Vismid® SOL   6954LDS

    Thermally conductive; superbly low water absorption,   low warpage, excellent dimensional stability, high heat resistance

    LCP

    Vismid® SOL 8365LDS

    30% GF   reinforced, high temperature resistance, high flow, high dimensional   stability, suitable for thin-wall and fast-cycle molding and SMT lead-free   soldering process

    Vismid® SOL 8485LDS

    40% Mineral reinforced, high temperature resistance,   high flow, low warpage, high dimensional stability, suitable for thin-wall   and fast-cycle molding and SMT lead-free soldering process

     


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